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Oct 30th, 2012
 
The Power of 3D integration: SEMI European 3D TSV Summit to confront the tough issues with exceptional lineup of experts
 
Global leaders in 3D technology will convene to discuss the latest advances in Grenoble on January 22-23, 2013 at the European 3D TSV Summit. This new SEMI event will take place in the heart of the French Alps, in one of the most dynamic European semiconductor clusters. It addresses the manufacturing aspects of 3D Integration and Through Silicon Via technology (TSV), with Laurent Malier, CEO of CEA-LETI, opening the event with a keynote positioning TSV technology in the semiconductor innovation landscape.
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TSV Technology is as important as the other hot topics in the industry, such as EUV and 450mm, and this is an opportunity to collectively make progress on the remaining technical and business challenges to facilitate high-volume manufacturing,” said Malier. “TSV is a critical   enabler of the “More than Moore” approach — Europe has key competencies in the field and a valuable leading position with a full ecosystem already existing.”

In addition, Eric Beyne of imec, Nicolas Sillon of CEA-LETI, and Jurgen Wolf of Fraunhofer-IZM will present their viewpoints and highlight recent product successes achieved with their industrial partners. In addition, they will share their perspectives on reducing overall Cost of Ownership, increasing market acceptance, and provide insight on the tight interdependencies between product design and technology.

Executives from design houses, fabless, IDMs, OSATs as well as Equipment and Materials suppliers will present during this unique two-day event.
Attendees will have an opportunity to   hear and meet representatives from Avantest, AMKOR, ams AG, BESI, Brewer Science, Cadence, EV Group, Fogale Nanotech, Multitest, Oerlikon Systems, Rudolph Technologies, Solid State Equipment LLC, SPTS, ST-Ericsson, STMicroelectronics, Suss MicroTec, Xilinx and more.

Having such an outstanding line-up of companies and speakers demonstrates that the momentum around TSV technology is genuine and shows a willingness on the part of key industry players to collectively make progress on the remaining technical and business challenges to enable high-volume manufacturing,” said Heinz Kundert, president of SEMI Europe.

The European 3D TSV Summit will feature plenary sessions, an exhibition, match-making business meetings, and a market briefing moderated by Yole Developpement. In addition, attendees will be offered an option to visit the CEA-LETI 300mm TSV line, considered one of the most impressive 3D R&D facilities in the world.

Early bird registration, exhibition booth booking and sponsorship opportunities will end on October 31.

Please visit www.semi.org/european3DTSVSummit for registration, exhibition information and sponsorship information. For additional information, contact Yann Guillou from SEMI Europe Grenoble Office ( yguillou@semi.org).

 

 
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