Powertec Technology Inc. (PTI, TWSE:6239) announced that it has entered into a share purchase agreement with Nepes Corp. (NC, KOSDAQ:033640 ) to acquire Nepes Pte Ltd (NPL) in Singapore.
With the acquisition of NPL's operationally ready, high volume 300mm electroplated wafer bumping and wafer level packaging manufacturing operations, PTI will establish its capabilities for electroplated wafer bumping and turnkey wafer level "chip scale" packaging in Singapore
NPL is the only 12" bumping house in Singapore that can provide the complete turnkey solution for costs and time efficiently for customers. Its strategic location in Singapore has enhanced the interaction with world-leading semi-conductor companies located in this region. With NPL's well-established turnkey solution and it strategic location, this acquisition will elevate PTI into a new stage of growth.
As part of PTI's continuing expansion, this new acquisition of NPL will improve our business growth to our existing customers by integrating the resources and asset from NPL. PTI will now increase its competitive advantage to lead the industry into innovative turnkey solution to better serve the customers' needs in this region.
"Through this acquisition, PTI will instantly expand its capacities in Singapore with experienced team to support our customers in this region" said Mr. DK Tsai, CEO of PTI.
"Nepes Corp. welcomes this acquisition and will maintain the corporation relationship with PTI in the future and with the support of PTI, NPL can continue to concentrate on production enhancement to stay competitive in rapidly changing semi-conducting industry," commented by Mr. BK Lee, CEO of Nepes Corp.