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May 22nd, 2012
 
Q&A: GSA Working Group tackles barriers to 3D-IC adoption
 
The Global Semiconductor Alliance (GSA) 3D IC Working Group is helping pave the way to mainstream adoption of 3D-ICs. With around 275 members, this group provides a neutral forum in which representatives of EDA vendors, design services houses, foundries, outsourced assembly and test (OSAT) providers, and other important ecosystem players can come together and work through the business and technical challenges posed by 3D-IC technology.
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Ken Potts, product marketing director at Cadence, recently became the chairman of the GSA 3D IC  Working Group. In this interview he talks about the business and technical challenges facing 3D-ICs, the role of the GSA working group, the advantages of 3D-ICs, the need for standards, and when 2.5D and 3D-ICs will come into volume production.

Q: Ken, what do you do at Cadence and how did you come to chair the GSA working group?

A: I'm very involved with strategic alliances in emerging technology areas. I'm involved in the Si2 [Silicon Integration Initiative] OpenAccess and OpenPDK coalitions, and I chair the Si2 Low Power Coalition, where we're pushing low power up into the systems space.

Full Q&A session here.

 

 
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