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Home  >  ADVANCED PACKAGING: 3D IC, WLP & TSV  > Raleigh/RTP to host the 43rd annual International Symposium ...
  >  ADVANCED PACKAGING: 3D IC, WLP & TSV BUSINESS/MARKET
Aug 2nd, 2010
 
Raleigh/RTP to host the 43rd annual International Symposium on Microelectronics...
 
IMAPS 2010 - International Conference and Exhibition on Microelectronics Showcases Advancements in Technologies Between the Chip and the System.
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Cree shimmer wall at the new Raleigh Convention Center
Cree shimmer wall at the new Raleigh Convention Center
The annual International Conference and Exhibition on Microelectronics returns to the U.S. East Coast this November, as leading scientists and engineers in the field of microelectronics gather in Raleigh/Research Triangle Park, NC on October 31 thru November 4, 2010 to showcase their work in a program of papers, panels, special sessions and an exhibition that will spotlight premier work in the fields of microelectronics, semiconductor packaging and circuit design. The 43rd International Symposium on Microelectronics will feature technical tracks on 3D Packaging/Interconnect, Design, Reliability, and Advanced Packaging & Materials.
 
This international technology forum for the presentation of applied research on microelectronics will be held at the new Raleigh Convention Center near Research Triangle Park, North Carolina, USA.  More than 180 papers will be presented by researchers from corporations, universities and government labs worldwide.
 
Early registration ends on September 28, 2010, go to http://www.imaps.org/ for more information, or contact Michael O'Donoghue at modonoghue@imaps.org.
 
Sponsored by the International Microelectronics And Packaging Society (IMAPS), the International Symposium on Microelectronics is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education.
 
About IMAPS
Founded in 1967, IMAPS is the leading international microelectronics and electronic packaging society with professional members in 23 North American chapters and 21 international chapters. Members of the Society represent every discipline and specialty in the electronics industry and include both technical and marketing professionals. IMAPS leads the Microelectronics Packaging, Interconnect and Assembly Community, providing means of communicating, educating and interacting at all levels. The Society's portfolio of technologies  is disseminated through symposia, conferences, workshops, professional development courses and other efforts. IMAPS currently has more than 4,000 members in the United States and more than 4,000 international members around the world.
 
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