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Feb 27th, 2012
Renesas semiconductor packaging roadmap: a closer look
Renesas was formed several years ago from parts of the electronic businesses of Hitachi, Mitsubishi Electric and NEC Electronics.
It is the world's largest manufacturer of microcontrollers and the second largest manufacturer of application processors. Renesas is also known for LCD drivers, RF ICs, mixed-signal integrated circuits and SOC semiconductors.
Automotive sector packaging
Renesas Advanced Packaging Roadmap
More detail is given on the next figure.
Renesas Packaging Roadmap Details
Their flip chip bonding roadmap is shown below
FC Bonding Technology Roadmap
The general roadmap for WLP is shown below:
The Renesas Fan out WLP process is a RDL first method where the RDL is first formed on the support followed by FC attach and molding. Their fan out roadmap is shown below.
Renesas FO- WLP Roadmap
Wide IO DRAM Solution for Application Processors
Renesas reports that they will use Via middle for mobile products and Via last (backside) for some other applications.
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