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Jul 15th, 2010
Rigid, room temperature curing thermal conductive epoxy for service up to 400°F
In many challenging bonding applications, elevated temperature cures are not possible. In order to overcome this deficiency, Master Bond has made available new EP21TCHT-1. Curable at room temperatures, EP21TCHT-1 has high thermal conductivity and superior electrical insulation properties. It has a service operating temperature range of 4K to 400°F. It also has a remarkably low thermal expansion coefficient. EP21TCHT-1 is NASA qualified for low outgassing applications. It is highly recommended for use in vacuum environments.
Master Bond EP21TCHT-1 is durable and possesses high physical strength properties. Adhesion to metals, ceramics, woods, vulcanized rubbers and most plastics is excellent. Bonds are resistant to water, fuels and most organic solvents. EP21TCHT-1 has a mix ratio of 100 to 60 by weight. It has a light paste viscosity and is easy to apply.
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