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Jun 12th, 2013
 
SEMICON Europa 2013 - Call for Papers – Extended
 
International MEMS/MST Industry Forum, 7-8 Oct 2013 and Advanced Packaging Conference (APC), 8-9 Oct 2013.
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“Taking MEMS to the next level”
The MEMS forum is an exceptional platform to explore the MEMS industry supply chain. The conference will review current and future applications of MEMS. It will examine viable production concepts and business models supporting growth and discusses material and process requirements that are needed to bring MEMS technology to the next level.

“The Power of Packaging”
The Advanced Packaging Conference provides a unique opportunity to learn more about new developments, package technologies, applications and package solutions for various products used in power applications and system integration.

To submit your abstract please click here. Deadline: 27 June 2013


 
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