Semicon Europa from October 8 to 10, 2013 in Dresden.
SEMICON Europa organizes over 40 programs and events in conjunction with the exposition. You are invited to submit your abstract for one of the following conferences:
International MEMS/MST Industry Forum
“Taking MEMS to the next level”
The MEMS forum is an exceptional platform to explore the MEMS industry supply chain. The conference will review current and future applications of MEMS. It will examine viable production concepts and business models supporting growth and discusses material and process requirements that are needed to bring MEMS technology to the next level.
Advanced Packaging Conference (APC)
“The power of packaging”
This conference will focus on the innovations and developments of the European and Global Semiconductor manufacturing industry that are aimed at improving the performance of the devices by the use of more efficient packaging technology. The aspects under review cover Power Handling, Size, Interconnection Interfaces, Thermal Management and Heat Dissipation. The presentations will shed light on recent application specific packaging technologies, processing and manufacturing related technologies which can be leveraged as key enablers for cost efficient electronic devices and systems.
Call for Papers details for all programs at SEMICON Europa 2013 are available online.
> Call for Papers on the homepage www.semiconeuropa.org
Don't miss this opportunity. Submit your abstract as soon as possible. Deadline for submission: 24 May 2013.