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Feb 11th, 2012
SILEX interview - through substrate vias: opportunities for CMOS MEMS and 3D integration
TSVs, or through substrate vias, have become an increasingly important building block for CMOS MEMS integration, as well as for stacking of multiple IC chips.
In this interview, we spoke with Tomas Bauer, VP of Sales and Business Development at Silex Microsystems about his perspective on the latest TSV trends. In particular, Tomas discusses TSV process parameters and sizes, existing and emerging applications, integration challenges, fill material comparisons and costs. He also discusses other materials for TSV substrates such as glass and silicon-glass hybrids.
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