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Oct 31st, 2013
SK Hynix licenses BeSang's 3D IC
Patent license agreement for 3D chip technology signed between SK Hynix and BeSang.
SK Hynix Inc. in Icheon, South Korea, has licensed the 3D chip technology of BeSang Inc. of Beaverton, Oregon. SK Hynix, which mainly makes DRAM and flash memory chips, will license what BeSang (which in Korean means "flying high") calls its "True 3D IC" process, which uses a low-temperature process to build multilayer 3D integrated circuits one layer at a time using traditional vias, instead of stacking finished die using through-silicon-vias (TSVs).
The patent-license agreement with SK Hynix calls for technology transfer including updates based on a service fee for a five-year period, but does not include collaboration. Also the agreement is non-exclusive, allowing BeSang the opportunity to strike similar deals with other chip manufacturers.
BeSang's 3D IC technology forms a single crystalline layer from a donor wafer and sequentially fabricates a second active layer on top of a standard active-device layer on a silicon substrate, using conventional vias to interconnect them.
BeSang’s 3D IC technology forms a single crystalline layer from a donor wafer and sequentially fabricates a second active layer on top of a standard active-device layer on a silicon substrate, using conventional vias to interconnect them.
SK Hynix specializes in DRAM, NAND flash, solid-state drives (SSDs), and image sensors, but the deal extends beyond memories to system ICs and even foundry business in the future. BeSang claims to have demonstrated that its 3D IC process works, not only with DRAMs, but with a wide variety of integrated circuit types, including CPUs, DSPs, GPUs, ASICs, FPGAs, SoCs, NAND flash, SRAM, and image sensors.
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