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Oct 10th, 2013
 
SMI introduces versatile MEMS pressure sensor for manifold designs
 
New versatile MEMS pressure sensor enables manifold designs for customers in automotive, industrial, and medical markets. Miniature SOIC-8 with broad absolute pressure ranges up to 100 PSIA allow for space constrained and cost sensitive applications.
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SMI (Silicon Microstructures, Inc.), a global leading developer and manufacturer of MEMS (Micro-Electro-Mechanical-Systems) pressure sensors for over 22 years, introduces the SM6841 Series MEMS pressure sensor designed especially for manifold designs. Available in absolute pressure ranges of 15, 30, 60, and 100 PSIA (103, 207, 414, and 690 kPa). The small footprint of the SOIC-8 is 5 x 6 mm2 including the leads and provides design flexibility in space challenged designs with a typical 100 mV output for signal-conditioning for analog or digital interfaces.

The SM6841 center-hole design enables manifold designs for automotive applications such as Tire Pressure Monitoring Systems (TPMS) to space-constrained medical applications in Negative Pressure Wound Therapy (NPWT).

The automotive qualified SM6841 provides customers design flexibility and high reliability for manifold designs in automotive, medical, and industrial markets,” said Dr. Michael Doelle, Vice-President of Marketing.

SMI debuts the SM6841 at Automotive Sensors and Electronics Expo 2013 in Detroit, Michigan, October 9.

About SMI
SMI is a premier developer and manufacturer of MEMS-based pressure sensors for a broad range of markets, with over 22 years of experience and expertise in low pressure and harsh environment pressure sensors that meet stringent requirements for medical, automotive and industrial applications. SMI’s design, production and quality control processes have enabled it to develop both the most sensitive and smallest MEMS pressure sensors available on the market.

SMI is a member of the worldwide Elmos Semiconductor Group, offering proven solutions to a range of industries, based on application-specific ICs, sensors and complete microsystems.

 
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