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May 14th, 2013
 
SPTS ships 1000th DRIE process module
 
Milestone shipment extends company’s leadership in DRIE.
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SPTS Technologies, a supplier of advanced wafer processing solutions for the global semiconductor industry and related markets,  announced the company had reached a milestone in shipping its 1000th deep reactive ion etch (DRIE) module. This announcement was made at the SEMICON Singapore MEMS Forum in recognition of the country’s growing status as a hub of MEMS activity.

Fundamental to DRIE is the switched Bosch process patented by Robert Bosch in 1994. SPTS was the original Bosch process licensee, shipping its first commercial system in 1995. Since that time, DRIE process capability has continuously improved to the point where etch rates in production exceed 30µm/min, aspect ratios can exceed 90:1 and device features of <50nm are achievable. Recently, DRIE is also being applied to through-silicon via (TSV) technology for 3D integration. SPTS remains the market-leading supplier of DRIE processing systems to a wide range of MEMS device manufacturers and packaging foundries.

This 1000th shipment is a proud moment for everyone at SPTS,” said Dr. Dave Thomas, marketing director for Etch Products at SPTS. “MEMS feature in every automobile, smartphone, tablet and gaming console on sale. Our lives are hugely enriched by these microscopic sensors, and in the near future our healthcare will become reliant on them. For nearly 20 years, our engineers have contributed to this widespread adoption by producing more reliable, cost effective DRIE systems with the precision and control that is required for ever more sensitive and functional devices. We continue to develop our DRIE technology for future generations of MEMS and related chip-sets.

 

 
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