STATS ChipPAC today announced it has ramped first generation embedded Wafer-Level Ball Grid Array (eWLB) technology to high volume production. The company has developed a robust manufacturing process in place to support first generation eWLB.

The eWLB technology provides solutions for semiconductor devices requiring a higher integration level and a greater number of external contacts. Using a combination of traditional ‘front-end’ and ‘back-end’ semiconductor manufacturing techniques, eWLB technology greatly reduces manufacturing costs while providing a smaller package footprint with higher Input/Output (I/O) along with increased thermal and electrical performance.

STATS ChipPAC has established a robust, automated eWLB manufacturing process that includes wafer reconstitution, wafer level molding, redistribution using thin film technology, solder ball mount, package singulation and testing. Incoming wafers in both 8” and 12” diameters can be supported, and no bumping is required as the package is essentially built on top of a reconstituted wafer.

“Backed by a strong infrastructure and cost effective manufacturing process, we are able to deliver a high performance solution at a lower cost point with volume and maturity, leveraging the potential of batch panel processing of high density wafer fabrication redistribution technology,” said Dr. Han Byung Joon, Executive Vice President and Chief Technology Officer of STATS ChipPAC.  “We successfully demonstrated the reliability of first generation eWLB technology, ramped to volume production and are positioned to double our production unit volume by the end of 2009.”

Typical applications for eWLB are baseband and RF products for mobile and consumer products.  The next generation of eWLB packages enabling reduced cost, multiple routing layers, multiple die, and expansion to larger package size and ball count is now being developed with STATS ChipPAC’s development partners for product offerings starting in 2010.