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Nov 19th, 2012
STATS ChipPAC to expand flip chip and 3DIC capacities in South Korea
STATS ChipPAC Ltd., a leading semiconductor test and advanced packaging service provider, announced plans to expand its semiconductor assembly and test operation in South Korea. The Company has signed a non-binding memorandum of understanding to invest in a new integrated facility in the Incheon Free Economic Zone, an international business district located in the Incheon metropolitan area that is adjacent to Seoul, South Korea.
The integrated facility will include approximately 95,000 square meters (1 million square feet) of land with options for future expansion. The integrated facility will be used for manufacturing, research and development, and administration. Construction is scheduled to begin in the third quarter of 2013 and the new facility is expected to be operational in the second half of 2015. STATS ChipPAC intends to integrate its existing facilities in South Korea into the new, larger facility to achieve a more efficient, cost effective manufacturing flow and provide flexibility for future expansion.
STATS ChipPAC Korea’s sizeable flip chip technology portfolio ranges from large single die fcBGA packages with passive components used for graphics, CPU and ASIC devices to smaller fcFBGA packages including single die, multi-die and stacked configurations that combine wire bond and flip chip technology within a single package. In terms of 3D technology, STATS ChipPAC Korea provides advanced Package-on-Package (PoP), Package-in-Package (PiP) and System-in-Package (SiP) technologies that integrate one or more integrated circuits or passives into a single solution for mobile, digital consumer and data storage applications.
“We are proud of the leadership position we have in advanced packaging technologies and the extensive manufacturing experience we have demonstrated over the years. We are excited to begin a new phase of expansion in South Korea with the opportunity to increase the level of manufacturing efficiency, capabilities and overall capacity for our customers,” said Sang-Jin Maeng, Managing Director, STATS ChipPAC Korea. “We believe our strategic partnership with Incheon International Airport Corporation (IIAC) will facilitate our future growth in South Korea due to the exceptional business infrastructure in Yeongjongdo and close proximity to Incheon International Airport for accessibility and efficient supply chain logistics.”
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