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Aug 8th, 2013
 
STMicro makes MEMS Technology available
 
STMicroelectronics and CMP (Circuits Multi Projets) announced that ST’s THELMA MEMS manufacturing process is now available for prototyping to universities, research labs and design companies through the silicon brokerage services provided by CMP.
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ST is releasing this process technology to third parties as a prototyping and foundry service to encourage new developments in motion-sensing applications for consumer, automotive, industrial and healthcare markets.ST’s long-term success in MEMS (Micro-Electro-Mechanical Systems) sensors has drawn upon Company-developed industry-leading manufacturing processes. The 0.8-micron, surface micro-machining THELMA (Thick Epitaxial Layer for Micro-gyroscopes and Accelerometers) process combines variably thick and thin poly-silicon layers for structures and interconnections. This enables the integration of linear and angular mechanical elements in a single chip, delivering significant cost and size benefits to customers.The CMP multi-project wafer service allows organizations to obtain small quantities--typically from a few dozens to a few thousand units--of advanced ICs manufactured using the same process technologies as would be used on much higher-volume products. The THELMA process design rules and design kits are now available for universities and microelectronics companies and the first requests are already being answered.The introduction of ST’s MEMS manufacturing process in CMP’s catalogue builds on the successful collaboration that has allowed universities and design firms to access ST’s semiconductor manufacturing processes from the 130nm CMOS, introduced in 2003, up to the 28nm FD-SOI technology, released for prototyping in late 2012, which enables the efficient design of next-generation mobile devices that simultaneously require high performance and low power consumption.


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