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> STS ships DRIE tool to Fraunhofer ISIT for MEMS & TSV inter...
> ADVANCED PACKAGING: 3D IC, WLP & TSV
Jun 12th, 2009
STS ships DRIE tool to Fraunhofer ISIT for MEMS & TSV interconnects
STS's Pegasus DRIE tools provide silicon etch capability for MEMS, 3D IC production and process development
STS announced that the company has received an order from Fraunhofer Institute for Silicon Technology ISIT for its market leading Pegasus DRIE system. This 200mm system will be used in a variety of projects within the research and development center for Microelectronics and Microsystems Technology which ISIT represents, providing research and production in one location.
Fraunhofer ISIT, based in Itzehoe, Germany develops and manufactures components in microelectronics and microsystems technology, from the design phase – including system simulation – to prototyping and fabrication of samples, up to series production for a wide range of applications such as medical care, environmental and traffic engineering, communication systems, automotive industry, and mechanical engineering. Working under contract, ISIT develops devices in accordance with customer requirements including full system integration using miniaturized assembly and interconnection technology. Together with Vishay Siliconix Itzehoe GmbH, the institute operates a professional semiconductor production line which is used in parallel for PowerMOS and microsystem production and for R&D projects developing new devices and technological processes. “We deal with a large variety of customers, creating a high demand for our deep silicon etch technology,” said Christian Schroeder of Fraunhofer ISIT. “The Pegasus system from STS is by far the most flexible tool to satisfy these varied and highly challenging specifications. In addition to process flexibility, we also require high etch rates with good uniformity and profile control for typical MEMS structures, and very fine CD control and smooth sidewalls for semiconductor and TSV applications. We are convinced that the Pegasus system delivers the best process capability available on the market place today”. Eizo Yasui, CEO of STS replied, “Winning this order at a leading European facility, with exposure to a large number of users, is important for us. We are confident our Pegasus provides the ideal combination of flexibility and market-leading process capabilities on a production-proven system, to enable Fraunhofer ISIT and their clients to transfer their own innovations into new business successes.” Sources :
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