To download the latest issue
Apr 22nd, 2014
STS semiconductor and Invensas to partner on high volume Bond Via Array (BVA) mobile solutions
Tessera Technologies, Inc. (Nasdaq: TSRA), announced that Invensas Corporation, its wholly owned subsidiary, and Seoul, South Korea-based STS Semiconductor & Telecommunications Co. Ltd. (KRX: 036540), a leading semiconductor assembly and test solution provider specializing in mobile and communication devices, have entered into an agreement to validate high volume manufacturing capability for Invensas' Bond Via Array (BVATM) technology for next generation smartphone and tablet customers.
BVA is a proven advanced Package-on-Package (PoP) technology for System on Chip (SOC) and memory integration in mobile devices. Styled as a "Bridge Technology to 3DIC", it is a unique solution that utilizes established wire-bond assembly techniques to enable low power and high-bandwidth (1000 IO+) packaging in an ultra-small form factor, ideal for mobile devices. STS's state of the art engineering and worldwide high-volume capabilities provide an ideal platform for high volume manufacturing of BVA.
More ADVANCED PACKAGING news