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Oct 28th, 2013
SUSS Technology Forum ASIA 2013
Save the dates and register now!
SUSS MicroTec would like to invite you to the SUSS Technology Forum ASIA 2013 covering the latest in materials, manufacturing technologies and market trends in 3DIC and Wafer Level Packaging.The SUSS Asia Technology Forum will be held on three separate dates at three convenient locations - Taiwan, China and Korea - and will feature speakers from industry leading companies and world-renowned research institutions.
Listen to interesting presentations and discussions in a relaxed atmosphere while exchanging experiences and establishing contacts.
SUSS MicroTec and partners look forward to welcoming you!
Hsinchu, Taiwan • November 13, 2013
Shanghai, China • November 15, 2013
Seoul, Korea • November 19, 2013
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