webleads-tracker

Home  >  ADVANCED PACKAGING  > SUSS MicroTec Launches Mask Aligner MA200 Gen3...
  >  ADVANCED PACKAGING
Apr 2nd, 2014
 
SUSS MicroTec Launches Mask Aligner MA200 Gen3
 
SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets, has launched the new Mask Aligner MA200 Gen3 today. The tool is designed for high volume manufacturing and can be used for exposing wafers with a diameter of up to 200 mm. This latest generation tool is a further development of the very successful MA200 Compact platform, of which the 100th tool was recently delivered to a customer.
Send to a friend
The MA200 Gen3 combines the well-established SUSS MicroTec Mask Aligner technology with several new features, which render it the leading exposure system in the areas of advanced packaging and MEMS. Special application fields are exposure processes with thick photo resists for advanced packaging, wafer level packaging and 3D integration as well as the production of MEMS.

The third tool generation incorporates an improved throughput as well as a better process administration and -definition. The new features lead to an overall improved cost of ownership.

Our well established Mask Aligner technology is upgraded regularly to meet the latest technological challenges and is constantly developed further to address the future demands of exposure applications.”, says Frank P. Averdung, President and CEO of SUSS MicroTec. “The advantages of the MA200 Gen3 are a high throughput of 140 200 mm wafers per hour coupled with very good process reliability.
 

 
More ADVANCED PACKAGING news

Jul 22nd
Jul 21st
Jul 16th
Jul 12th
Jul 12th
 
©2007 Yole Developpement All rights reserved                  Disclaimer | Legal notice | To advertise
Yole Développement: Le Quartz, 75 cours Emile Zola, 69100 Villeurbanne, France. TEL: (33) 472 83 01 80 FAX: (33) 472 83 01 83 E-Mail: info @yole.fr