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May 15th, 2014
SUSS MicroTec delivers enhanced coater/developer-system for Fan-Out Wafer-Level Packaging applications
SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets, has recently delivered a newly developed coater/developer tool to an Asian packaging foundry (OSAT).
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The system is based on SUSS MicroTec’s industry proven ACS300-technology. The ACS300 tool is a modular cluster system designed to meet manufacturers' needs for clean, reliable and high throughput photolithography applications.

The tool was especially developed to process wafers for Fan-Out Wafer-Level Packaging applications. With this coater/developer system artificially created wafers, which can be larger than 300 mm, can be processed. On embedding chips on an artificial wafer, a certain space has to be ensured between the individual dice, for instance to allow for Fan-Out redistribution layers (RDL). This enables the formation of nearly as many micro-bumps per microchip as wanted, regardless of the size of the single chip. It is an enhancement of the standard packaging solutions for highly integrated microchips.

"We have developed new solutions and processes for cost efficient and high throughput applications for Fan-Out Wafer-Level Packaging,” says Frank P. Averdung, President and CEO of SUSS MicroTec. “Our tailor-made solutions allow customers to move beyond standard processes and applications to drive the technological development in the semiconductor industry further.”



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