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Feb 7th, 2012
 
SUSS launches new wafer bonding, debonding & cleaning platform for 3DIC applications
 
SUSS MicroTec, a leading supplier of equipment and process solutions for the semiconductor and related markets, launched the XBC300 Gen2, a high volume manufacturing platform for advanced 3D processing. The new bonding equipment can be used for permanent wafer bonding, or debonding and cleaning of 200mm and 300mm wafers. It is designed for production as well as process development.
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Suss XBC300 Gen2.
Suss XBC300 Gen2.

Configurable with a wide selection of process modules, the new universal bonder platform is suitable for all major permanent bonding as well as mechanical debonding processes at room temperature. The corresponding cleaning processes for 3D integration and 3D packaging are also supported. The high force bonding processes that can be run on the XBC300 Gen2 include Cu-Cu, polymer, fusion and hybrid bonding.

When configured as a debonder and cleaner the XBC300 Gen2 is the complementary platform to SUSS MicroTec’s XBS300 temporary wafer bonder, which was launched in December 2011. Device wafers are temporarily bonded to a carrier in the XBS300 and are debonded on the XBC300 Gen2 after passing all the backside processing steps. The XBC300 Gen2 debonder / cleaner is configured for handling both, carrier wafers as well as film frames. It allows for room temperature mechanical debonding and subsequent cleaning of carriers and device wafers.

“The XBC300 Gen2 allows complete process flexibility with full automation and offers our customers a superior cost of ownership. While the first generation XBC300 only offered configurations with up to three process modules, the new generation can be equipped with up to six modules, enabling the high throughput required in volume manufacturing. ”, says Frank P. Averdung, President and CEO of SÜSS MicroTec AG. “With the XBS300 and the XBC300 Gen2 we offer our customers a complete, state-of-the-art set of automated equipment for thin wafer handling in 3D integration and 3D packaging processes.”

 

 
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