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Mar 31st, 2014
Save the date for IMAPS France MiNaPaD Forum
To be held at the Minatec in Grenoble from May 20-22.
IMAPS France announces the 3rd edition of the Micro/Nano-Electronics Packaging and Assembly Design and Manufacturing Forum (MiNaPaD) to be held at the Minatec in Grenoble from May 20-22. The conference will feature three keynote presentations, 30 papers, a vendor exhibition, a poster session and four tutorials on May20. Registration, online payment and program details may found on the IMAPS France website.
Keynotes will be delivered by Rozalia Beica of Yole Développement who will speak about “Converging Technologies toward 3D Packaging Solutions.” Jacques Favre of aCSP-3D who will present “3D Packaging, a Paradigm Shift for Power Products”, and Axel Webber of Continental.
Further information is available on the website or by contacting Florence Vireton at +33 (0) 1 39 67 17 73.
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