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Jan 7th, 2011
Save the date for the Workshop on Micropackaging and Thermal Management
In La Rochelle on February 2nd and 3rd, 2011.
IMAPS is a well-known society in charge of promoting Microelectronics, Interconnection and Packaging industries as well as supporting high level academic research.
- Chip-level, board-level and system-level thermal management
Presenting companies originate from France, the USA, Germany, Austria, Switzerland, Belgium and Spain. They include Accelonix, Airbus, AMS Technologies, AOS thermal products, Asymtek, E2V, Hoffmann, Lord Corporation, Protavic, Novapack Technologies, Reinhardt Microtech, Staubli, Tecnalia, Thales, Wolverine and Yole Développement.
Aside from the conference, a table top exhibition will be held.
Do not miss this opportunity to meet with the European and international community of thermal management of electronic systems!
Please find the conference program on http://www.imapsfrance.org/
For more information, and to register, please contact Florence Vireton 33 ( 0)1 39 67 17 73 email: email@example.com
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