Home  >  ADVANCED PACKAGING  > Semicon Taiwan 2013 spotlights opportunities in fab ...
Jul 3rd, 2013
Semicon Taiwan 2013 spotlights opportunities in fab innovation and advanced packaging
Registration now open for SEMICON Taiwan 2013, the premier microelectronics event in Taiwan!
Send to a friend

Progressive changes to manufacturing processes, equipment, materials, technical challenges, and emerging market opportunities  will highlight SEMICON Taiwan 2013— along with product displays of the latest semiconductor manufacturing technologies. The region’s premier microelectorics event-- SEMICON Taiwan will be held September 4-6 at the Taipei World Trade Center Nankang Exhibition Hall featuring over 650 exhibiting companies and more than 110 prestigious speakers from world’s leading companies. The online registration is now open at www.semicontaiwan.org. Register before Aug. 9 to get program early-bird discount!

According to the data shared by SEMI and Semiconductor Equipment Association of Japan (SEAJ), worldwide semiconductor manufacturing equipment billings reached US$ 7.31 billion in the first quarter of 2013. The billings figure is 8 percent higher than the fourth quarter of 2012 while the billings figure is 31 percent higher than last quarter showing Taiwan is outperformed other countries.
We can forecast the recovery regarding semiconductor equipment and materials industries since the second half of 2013, optimistic outlook of rapid investment, coupled with 3D printing industry booming nowadays driven MEMS and precision machinery business opportunities, SEMICON Taiwan is “must-attend” annual event for the semiconductor industry to engage latest technology and detail upcoming opportunities, ” said Terry Tsao, president of SEMI Taiwan and South East Asia. 

Theme Pavilions at SEMICON Taiwan 2013
SEMICON Taiwan 2013 features 5 theme pavilions including 3D IC & substrate, MEMS, green manufacturing, secondary market, and precision machinery, as well as LED and country pavilions, each focused on growing critical technology markets.
- The MEMS Pavilion spotlights latest technologies for MEMS design and manufacturing.
- The Green Manufacturing Pavilion features the current tools and technologies needed to embrace sustainability.
- The Secondary Equipment Pavilion showcases cost-effective solutions for foundry and OSATs.
- The Precision Machinery Pavilion displays both advanced and cost-effective solutions in parts, materials and solutions for wafer processing and back-end.
- The LED Taiwan Pavilion features manufacturing technologies and new developments specially focused on advanced LED lighting applications.
- The 3D IC & Substrate Pavilion displays advanced technologies and solutions for 3D IC , TSV and substrate.

More Than 110 Technical and Business Sessions at SEMICON Taiwan 2013
In addition to scores of exhibitors featuring products and technologies dedicated to emerging and growing market technologies, SEMICON Taiwan 2013 technical and business forums will bring together worldwide and regional leaders such as ASE, GLOBALFOUNDRIES, IBM, Micron, STMicroelectronics ,TSMC ,and Qualcomm to feature more than 110 technical presentations on the market trends and cutting-edge technologies. Scheduled sessions include: Executive Summit, IC Design Summit, Market Trends, Memory Executive Summit, CMP Forum, Green Manufacturing,MEMS, LED and two technology symposiums— Litho/mask and advanced packaging.

SiP Global Summit Highlights Embedded Substrate and Technologies for 3D IC Volume Production
SiP Global Summit, the most prestigious summit focusing on advanced packaging and testing technology development in Taiwan will hold it’s 3rd annual event in conjunction with SEMICON Taiwan. Industry leaders from Amkor, SPIL, SPTS, Nanya PCB, Unimicron, Teradyne, Qualcomm, Yole Développement, SUSS, Senju will share their insights and solutions for accelerating 3D IC volume production.
The SiP Global Summit is contributed and supported by SEMI Taiwan Packaging & Test Committees – the executvies from Amkor, ASE, ChipMOS, GlobalUnichip, Nanya, SPIL, TSMC and leading semiconductor equipment and materials companies.  In addition to the industry contributors, SiP global summit is also under the auspices of 3 research organizations: Fraunhofer, I-Shou University, and Industrial Technology Research Institute (ITRI).

Sign up before August 9 to Get Forum Discount and Win Prizes!
SEMICON Taiwan and concurrent business/technology forums are now open for online registration with 7 forum Early-bird discounts. People who sign up before Aug. 9 and visit on-site will earn a chance to win limited-edition gifts and daily lucky draw prizes.  REGISTER now at www.semicontaiwan.org.

About SEMI
SEMI is the global industry association serving the micro- and nanoelectronics manufacturing supply chains. SEMI member companies are the engine of the future, enabling smarter, faster and more economical products that improve our lives. Since 1970, SEMI has been committed to helping members grow more profitably, create new markets and meet common industry challenges. SEMI maintains offices in Beijing, Bengaluru, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C. For more information, visit www.semi.org.


Sep 1st
Aug 29th
Aug 25th
Aug 12th
Aug 12th
©2007 Yole Developpement All rights reserved                  Disclaimer | Legal notice | To advertise
Yole Développement: Le Quartz, 75 cours Emile Zola, 69100 Villeurbanne, France. TEL: (33) 472 83 01 80 FAX: (33) 472 83 01 83 E-Mail: info @yole.fr