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Sep 18th, 2012
Silicon & glass interposers among the top 5 key elements of the semiconductor roadmap for the decade 2010-2020
Yole Développement announces its 3D Glass & Silicon Interposers report.
In this report, Yole Développement provides a complete analysis of the silicon and glass interposers market. Yole Développement’s analysts explain why and how 2.5D integration will impact more than 15% of the IC substrate business by 2017.
2.5D and 3D integration is set to be a long-lasting trend in the semiconductor industry
In this 2012 edition of that report, Yole Développement team provides more evidence of its findings from two years ago: after refining the applications and drivers of 3D interposers and 2.5D integration with the use of detailed forecasts, Yole Développement estimates that far from being a stepping-stone technology to full 3D integration, 3D interposers and 2.5D integration is emerging as a mass volume, long-lasting trend in the semiconductor industry.
The business generated by the 2.5D interposer substrate will grow rapidly, to an expected total value of $1.6B in 2017
Strong digital drivers will shift technology and supply chain paradigms
Also, we show evidence that this emerging infrastructure, which was initially focused on MEMS and sensors, is shifting paradigms to logic modules driven by stringent electrical and thermal performance requirements. As a result, the demand for interposers is shifting to fine-pitch 300mm diameter silicon wafers and high-accuracy flip chip micro-bumping and assembly,” explains Jérôme Baron, Business Unit Manager, Advanced Packaging at Yole Développement.
Graphical Processor Units for gaming and computing and high-performance ASICs and FPGAs are paving the way, with high volumes first expected in 2013. As these drivers increasingly appear as must-haves to serve the ever-increasing need for larger electrical bandwidths imposed by graphical sophistication, cloud computing and many more end uses, leading companies are busy creating the appropriate infrastructure.
Wafer foundries appear to be the most able entities to offer manufacturing solutions on the open market, both technically and in terms of capex investment capabilities. But their ambition extends far beyond the manufacturing of wafers, and into assembly and test services as well.
Concurrently, some of the major IDMs are preparing to exploit their wide capabilities and to enter the open foundry and assembly services side for 2.5D and 3D integration based on such new type of IC package substrate technologies.
Is cost really an issue in the long term?
The question now is: “can anyone build a profitable business case to support the growth of 2.5D/3D interposers”? In other words, how long will it take for investing companies to be paid back, while offering affordable prices to their customers? Yole Développement expects the expansion model of this new technology trend to follow a traditional path: first, high-value modules are expected to use the technology to offer unprecedented high performance, followed by higher volume applications.
“The nice thing about 2.5D interposers is that they do not only allow for unprecedented performance: they can do so for a much lower cost than any competing technology. Through a few cost cases in this report, we demonstrate that cost can be a strong adoption driver too. No, silicon and glass interposers are not “additional dead pieces of hardware in the package” - on the contrary, they are among the top five key elements of the semiconductor roadmap for the decade 2010-2020,” adds Jean-Marc Yannou, Senior Analyst, Advanced Packaging at Yole Développement.
More information on the report here.
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