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Jul 3rd, 2013
Siliconware announces entrance into high density 2.5D interposer market
New business model for interposer based SiP’s: the turnkey OSAT model.
At the ConFab conference in Las Vegas this week Mike Ma, VP of Corporate R&D at Siliconware (SPIL), announced a new business model for interposer based SiP’s, namely the “turnkey OSAT model.”
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