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Jul 3rd, 2013
Siliconware announces entrance into high density 2.5D interposer market
New business model for interposer based SiP’s: the turnkey OSAT model.
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At the ConFab conference in Las Vegas this week Mike Ma, VP of Corporate R&D at Siliconware (SPIL), announced a new business model for interposer based SiP’s, namely the “turnkey OSAT model.”

Over the past few years, TSMC has been proposing a turnkey foundry model which has met with significant resistance from their IC customers. Under the foundry turnkey model, the foundry handles all operations including chip fabrication, interposer fabrication, assembly and test. Foundry rivals UMC and GlobalFoundries, have been supporting a OSAT/Foundry collaboration model where the foundries would fabricate the chips with TSV and the OSATs would do assembly of chips and interposers that could come from several different sources.


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