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> MEMS EQUIPMENT
May 22nd, 2010
Sonoscan shows MEMS cavity seal integrity
As part of its bonded wafer inspection technology, Sonoscan has recently demonstrated acoustic imaging of defects in the seal that surrounds and protects the cavities in MEMS devices.
Sonoscan acoustic images of voids (left) and a breached seal (right) in MEMS devices before wafer dicing
The defects most frequently take the form of voids (Device 1 above) within the seal, which may be direct Si, metallic, glass or polymer, depending on the reliability level of hermetic seal required as per SEMI MS8-0309. In some locations on a wafer the seal may be breached (Device 2 above). Another frequent defect is delamination of the seal from one or both substrates, the result of poor wetting or contamination during fabrication. About Sonoscan: Sources :
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