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Apr 9th, 2014
Sony curves images sensors & TSMC stacks them
Two papers at an upcoming engineering conference promise to take image sensors in new directions.
The image sensor market leader Sony Corp. is due to report on an improved CMOS image sensor that uses a curved substrate to improve the image fidelity and reduce the dark current. At the same event, the Symposium on VLSI Technology, which takes place June 9-12 in Honolulu,engineers from TSMC will report on a CMOS image sensor with a 3D stacked architecture.
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