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Sep 3rd, 2011
 
Sony licenses Ziptronix patents for BSI wafer bonding
 
Ziptronix signs licensing agreement with sony for the use of ZiBond technology in BSI image sensors.
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Ziptronix has signed a licensing agreement with Sony for the use of Ziptronix’s patents regarding oxide bonding technology for BSI sensors. “We believe that Ziptronix’s patented oxide bonding technology, called ZiBond, enables the industry’s lowest distortion for imaging systems utilizing backside illumination” said Dan Donabedian, CEO of Ziptronix, Inc. “The result is that pixels can be scaled smaller, resulting in more die per wafer. Users of ZiBond technology benefit because yields are dramatically improved and production costs reduced.”

 

“Our patented bonding technology revolutionizes how light is received in imaging sensors. This is critically important for backside illumination applications,” said Donabedian. “The market for image sensing products is expected to exceed $16 billion cumulative over the next four years. Because ours is an innovative, enabling technology, I expect Ziptronix to play a leadership role in the backside illumination space as well as several other developing markets.”

 
Typical BSI process flow using ZiBond technology (Courtesy of Ziptronix).
Typical BSI process flow using ZiBond technology (Courtesy of Ziptronix).

No Sony comment is quoted in the PR.


 
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