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Jan 18th, 2012
 
Sony plans to use TSV for its next gaming station CPU/GPU
 
Sony Computer Entertainment is planning on a much longer shelf life for its next generation PlayStation gaming console with a strategy that appears to be based around refreshing the platform over its lifetime with a series of high profile, cutting edge technology including TSV interconnects base packaging.
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Masaaki Tsuruta, CTO of Sony Computer Entertainment.
Masaaki Tsuruta, CTO of Sony Computer Entertainment.

Masaaki Tsuruta, CTO of Sony Computer Entertainment, says that the company is working on a system-on-chip (SoC) to underpin the product for "seven to 10 years". The PlayStation 3 will be at least seven years old by the time its successor arrives, but is generally considered to have lasted longer than was originally expected. A firm launch for the fourth generation console - not to be called PlayStation 4 - was pushed out again late last year. Its designed-in longevity is largely a matter of economics.

The Cell Broadband Engine that powered the PS3 cost $400m to develop; the main SoC for the incoming console is likely to be a 3D stack incorporating thru-silicon-via technology and could be the first $1bn hardware design project. “We have to look at two things,” Tsuruta-san says, “return-on-investment (ROI) and turnaround time (TAT).” The ROI issue, given the further costs of bringing a new PS to market (software, marketing, etc), means that Sony will be looking at a number of years and revs of the machine's insides.

To read the complete article, please go to http://mandetech.com.

 

 
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