|
|||||||||||||||||
|
|
Home
> ADVANCED PACKAGING
> Sony plans to use TSV for its next gaming station CPU/GPU...
> ADVANCED PACKAGING
Jan 18th, 2012
Sony plans to use TSV for its next gaming station CPU/GPU
Sony Computer Entertainment is planning on a much longer shelf life for its next generation PlayStation gaming console with a strategy that appears to be based around refreshing the platform over its lifetime with a series of high profile, cutting edge technology including TSV interconnects base packaging.
Masaaki Tsuruta, CTO of Sony Computer Entertainment, says that the company is working on a system-on-chip (SoC) to underpin the product for "seven to 10 years". The PlayStation 3 will be at least seven years old by the time its successor arrives, but is generally considered to have lasted longer than was originally expected. A firm launch for the fourth generation console - not to be called PlayStation 4 - was pushed out again late last year. Its designed-in longevity is largely a matter of economics. Sources :
More ADVANCED PACKAGING news May 24th
May 22nd
May 21st
May 18th
May 17th
|
||||||||||||||||
©2007 Yole Developpement All rights reserved Disclaimer | Legal notice | To advertise
Yole Développement: Le Quartz, 75 cours Emile Zola, 69100 Villeurbanne, France. TEL: (33) 472 83 01 80 FAX: (33) 472 83 01 83 E-Mail: info @yole.fr |
|||||||||||||||||