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Dec 13th, 2012
Straight talk On 3D TSVs
Semiconductor Manufacturing & Design sat down to discuss 3D device challenges and applications with John Lau, a fellow at the Industrial Technology Research Institute (ITRI), a research organization in Taiwan.
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SMD: What is ITRI doing in 3D TSVs?
Lau: At ITRI we have developed the world’s first Applied Materials’ 300mm (3D TSV) integration line. The line was completed two years ago. We developed the process from the very beginning to the end. We don’t have products. We are demonstrating the feasibility for 3D TSVs.

To read the complete interview from Mark Lapedus, please click here.



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