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Jan 30th, 2014
Suss and EVG highlight laser based temporary bonding release: a closer look
The recent Architectures for Semiconductor Integration & Packaging Conference (ASIP) in Burlingame CA, Suss and EVG examined their processes and equipment available for temporary bonding and debonding for 2.5 & 3DIC. iMicronews felt it was worth…A Closer Look
They are both working with a number of materials suppliers all of which now supply room temp (RT) debonding solutions.
Temporary Bonding / Debonding as Part of Advanced PaAckaging
Temporary Bonding Materials Programs
Typical thickness and TTV requirements are dependant on the application with thicker layers required to enclapsuate bumped interfaces as shown below.
Thickness and TTV Requirements by Application (Courtesy of Suss MicroTec)
Suss Technology for Laser Debonding (Courtesy of Suss MicroTec)
EVG is also promoting a laser-initiated debonding process flow as shown below.
EVG Laser-Initiated Debonding - Process Flow
Brewer Laser Release Technology (Courtesy of Suss MicroTec)
Cleaning Chemicals Can Degrade Flex Frame Tapes (A); Cleanming Modules Should Protect Tape and Frame (B) (Courtesy of Suss MicroTec)
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