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Jan 30th, 2014
Suss and EVG highlight laser based temporary bonding release: a closer look
The recent Architectures for Semiconductor Integration & Packaging Conference (ASIP) in Burlingame CA, Suss and EVG examined their processes and equipment available for temporary bonding and debonding for 2.5 & 3DIC. iMicronews felt it was worth…A Closer Look
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They are both working with a number of materials suppliers all of which now supply room temp (RT) debonding solutions.  

Temporary Bonding / Debonding as Part of Advanced PaAckaging


Temporary Bonding Materials Programs


Typical thickness and TTV requirements are dependant on the application with thicker layers required to enclapsuate bumped interfaces as shown below.

Thickness and TTV Requirements by Application (Courtesy of Suss MicroTec)


Suss has now introduced eximer laser assisted RT debonding which was first introduced by 3M years ago.

Suss Technology for Laser Debonding (Courtesy of Suss MicroTec)


EVG is also promoting a laser-initiated debonding process flow as shown below.

EVG Laser-Initiated Debonding - Process Flow

Brewer has introduced a new UV absorbing release layer which is stable up to 350 ˚C.

Brewer Laser Release Technology (Courtesy of Suss MicroTec)

Also important is the release of the thinned wafer onto a flex frame support. Exposure to cleaning chemicals can lead to tape degradation, but Suss reports that modification of the thin wafer cleaning module helps eliminate this yield loss mode.

Cleaning Chemicals Can Degrade Flex Frame Tapes (A); Cleanming Modules Should Protect Tape and Frame (B) (Courtesy of Suss MicroTec)



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