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Sep 24th, 2013
 
TSMC and Cadence deliver 3D-IC reference flow for true 3D stacking
 
New reference flow enhances CoWoS™ (chip-on-wafer-on-substrate) chip design - flow certified using a memory-on-logic design with a 3D stack.
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Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation,  announced that TSMC has collaborated with Cadence to develop a 3D-IC reference flow which features innovative true 3D stacking. The flow, validated on a memory-on-logic design with a 3D stack based on a Wide I/O interface, enables multiple die integration. It incorporates TSMC 3D stacking technology and Cadence® solutions for 3D-IC, including integrated planning tools, a flexible implementation platform, and signoff and electrical/thermal analysis.

3D-IC technology enables companies to seek power/performance advances by opening up a new opportunity in addition to moving to advanced geometries. Offering several key benefits for engineers developing complex designs, 3D-ICs deliver higher performance, reduced power consumption, and smaller form factor. Today’s announcement follows work the two 3D- IC leaders announced a year ago with the delivery of TSMC’s CoWoS™ Reference Flow.

We have worked closely with Cadence to enable true 3D chip development,” said Suk Lee, TSMC senior director, Design Infrastructure Marketing Division. “With this new reference flow, our mutual customers can move forward confidently with 3D-IC development, knowing that their Cadence tool flow has been validated in silicon with 3D-IC test vehicles.”

3D-IC represents a dramatic new approach to product integration. It provides a new dimension to Moore’s Law and requires a deep collaboration for a seamless enablement offering,” said Dr. Chi-Ping Hsu, chief strategy officer and senior vice president of the digital and signoff group at Cadence. “This latest reference flow demonstrates real progress in our work with TSMC to make 3D chips not just viable, but an attractive option for addressing chip complexity.”

Tools in the Cadence 3D-IC flow span digital, custom/analog and signoff technologies. They include Encounter® Digital Implementation System, Tempus™ Timing Signoff Solution, Virtuoso® Layout Editor, Physical Verification System, QRC Extraction, Encounter Power System, Encounter Test, Allegro® SiP, and Sigrity™ XcitePI/PowerDC.

 

 
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