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Dec 13th, 2013
 
TSMC builds up bumping capacity
 
New 12-inch wafers bumping capability for TSMC.
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Taiwan Semiconductor Manufacturing Company (TSMC) has built up its bumping capacity to 150,000 12-inch wafers a month with total shipments amounting to over five million units, according to industry sources.

TSMC's bumping capacity began to grow in importance recently after the main bumping facilities of Advanced Semiconductor Engineering (ASE) in Kaohsiung were ordered to cease operations by a relevant government agency for dumping untreated wastewater into a river adjacent to the bumping plant, the sources noted.

Since ASE is the leading bumping service provider in Taiwan, the suspension of bumping services at the company's K7 plant, which has been accused for discharging wastewater containing strong acid and toxic heavy metals, has triggered concerns of a possible disruption of related supply chains or affected operations at TSMC or United Microelectronics Corporation (UMC).

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