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Apr 22nd, 2014
 
TSMC to ramp IC packaging revenues to US$1 billion in 2015, says paper
 
Taiwan Semiconductor Manufacturing Company (TSMC) aims to ramp up its IC packaging revenues to US$1 billion in 2015 and to US$2 billion in 2016, according to a Chinese-language Economic Daily News(EDN) report.
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TSMC is currently offering CoWoS (chip-on-wafer-on-substrate) packaging services for 2.5D ICs, the paper quoted TSMC co-CEO CC Wei as saying.

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