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Jul 27th, 2012
Taiwan’s leading OSAT to boost 3DIC capacity
In face of Taiwan Semiconductor Manufacturing Co.’s (TSMC’s) development of 3-dimension IC packaging for 20nm process technology it is working on, Taiwan’s leading IC assemblers are vigorously boosting 3D IC packaging and test capacity.
The assemblers include Advanced Semiconductor Engineering Inc. (ASE), Siliconware Precision Industry Co., Ltd. and Powertech Technology Inc. Industry executives pointed out that the three are the most financially capable assemblers in Taiwan to invest in 3D IC R&D and manufacturing capacity.
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