Tango Systems, Inc., a leading manufacturer of high-performance PVD systems, has joined the Micro-Electro-Mechanical-Systems (MEMS) Consortium launched by The Institute of Microelectronics (IME), a research institute of the Agency for Science, Technology and Research (A*STAR), on April 8th 2010.

“Tango Systems has been an active member of two key consortiums, MEMS and EPRC-10, launched by IME. The aim of the MEMS Consortium is to bring the emerging technologies of MEMS into manufacturing in Singapore and EPRC-10 is to address the integration challenges of 3-dimensional (3D) packaging technologies. We have seen promising results working with Tango Systems,” said Dr. Rakesh Kumar, Deputy Lab Director (Semiconductor Process Technology) of The Institute of Microelectronics.
 
Mr. Ravi Mullapudi, President & CEO of Tango Systems said, “Tango Systems has been working with IME in EPRCs Consortiums for several years. Tango was able to demonstrate 10:1 high aspect ratio barrier and seed layer deposition solution enabling fabrication of very high quality TSVs. Now, we look forward to collaborating with IME to develop piezoelectric thin film technologies with demanding specifications for RF MEMS applications.”

About Tango Systems, Inc
Tango Systems, Inc. is an innovative technology and cost leader, providing high volume sputtering solutions to advanced packaging applications of Through-Silicon Via (TSV), flip chip and wafer level packaging.

Tango System, Inc.'s Axcela™200/300 platforms are the first in a new line of Small-Batch-Cluster tools, designed to meet the processing needs of the advanced packaging and MEMS industry. The unique Small-Batch-Cluster architecture, coupled with the patent-protected D-Source magnetron technology and unique ICP clean configuration, make the Axcella™200/300 series tools the most flexible, reliable, and cost effective systems in their class. The scalability and processing capabilities of the platform are driving Tango Systems, Inc. rapidly into a wider array of product markets.