Get inside the first high volume Through Silicon Via implementation. This exclusive report, jointly published by Chipworks and Yole Developpement, analyzes the technology and economics behind Toshiba’s latest Dynastron CMOS Image Sensor. Leveraging downstream product teardowns and semiconductor reverse engineering this report provides evidence-based analysis on the technical achievements and cost of the device

Chipworks Inc., a leading reverse engineering company and Yole Developpement, a market research structure specialized in the advanced packaging industry analysis announce they have combined their efforts and in-house expertise to release an exclusive joined report on Toshiba’s latest CMOS image sensor featuring TSV ‘Through Silicon Vias’ interconnects.

The new report features three different chapters presenting the market perspectives, a technical analysis and a reverse costing analysis of the first high volume Through Silicon Via implementation. This work is being based on more than 50 high quality tear-down analysis pictures (using SEM, Optical and X-Ray methods) that Chipworks has recently realized on Toshiba’s lasted TSV / WLP camera module. The reverse costing analysis is based on Yole’s TSV+ Cost Modeling tool, a cost model that the company has been developing in strong interaction with 3DIC equipment and semiconductor players since 2 years now.  “This is the first time a market research and a reverse engineering company combine into one single package their added value. Through this type of unique content, we hope we will be able to provide semiconductor marketing executives with better understanding of the present and future economic impacts of TSV / WLP technologies on the CMOS image sensor market.” said Jean-Christophe Eloy, President & CEO of Yole Developpement.

KEY FEATURES

• More than 50 high resolution images (SEM, Optical, X-Ray) of Toshiba’s TSV VGA sensor and camera module
• Complete Reverse Costing Analysis of the miniature VGA camera module component (from the Front-end , TSV / WLP packaging to the optical module assembly)
• Full decomposition of the TSV / WLP manufacturing process sequence that highlights the major technical hurdles that have been solved
• Analysis of WLP / TSV market opportunities in CMOS image sensor applications

OBJECTIVES OF THE REPORT

• To combine the key analysis of a market research supplier and a reverse engineering firm into a report that delivers value across the organization
• To deliver a complete analysis of the first, high volume Through-Silicon-Via (TSV) implementation, with highlights on:
> Present & future market landscape for this product and technology
> Analysis of the TSV manufacturing process flow sequence and final assembly cost structure of the full camera module with evidence obtained from reverse engineering work

The new report is available now for purchase from either company for the same price. For more information, please click here or contact David Jourdan at jourdan@yole.fr or Steve Brown at sbrown@chipworks.com.

ABOUT THE AUTHORS

Chipworks Inc. is the recognized leader in reverse engineering and patent infringement analysis of semiconductors and electronic systems. The company’s ability to analyze the circuitry and physical composition of these systems makes them a key partner in the success of the world’s largest semiconductor and microelectronics companies. These companies depend on Chipworks to secure, defend, and grow market share, and to save millions of dollars in royalty payments and product design costs, allowing them to earn millions by licensing patents, designing superior products, and launching new products faster.

Yole Développement is a market research and strategy consulting company, facilitating market access for advanced technology industrial projects. With more than 20 consultants, Yole Développement is working worldwide with the key industrial companies, R&D institutes and investors in order to help them to understand the markets and technology trends in the MEMS, Advanced Packaging, Compound Semiconductor & Solar industry fields.