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Mar 21st, 2013
Triton Micro Technologies enters the glass interposer business – a closer look
At the recent IMAPS Device Packaging Conference in Scottsdale AZ Asahi Glass (AGC) and nMode Solutions of Tucson AZ announced that they had invested $2.1 million to co-found Triton Micro Technologies to develop glass based 2.5D Interposers. iMicronews thought this was worth A Closer Look.
The new company is headquartered in Tucson AZ with a manufacturing facility planned in CA.
Triton glass interposer design flow
AGC uses Alkali-free Boro-Aluminosilicate Glass, EN-A1, which has low CTE and thermal expansion properties matched to silicon in order to reduce stress when wafer bumping the die to the interposer. AGC‘s EN-A1 reportedly has refractive properties which allow for a low taper when laser drilled, providing for precise pitch control and hole size.
CTE vs Temperature for EN-A1 and Silicon
EN-A1 has a highly polished surface and can readily accept either thin-film or thick-film metallization directly on the glass without the need for an adhesion layer. Copper and Silver thick-film have been tested on EN-A1 with excellent results. Surface roughness of 10 Å or less is typical.
EA-N1 wafer properties are shown in the table below:
Typical EN-A1 wafer properties
Typical design specifications are shown in the table below:
Typical design specs for EN-A1 interposers
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