Direct imaging achieves resolution of 5 µm L/S and high throughput of 35 Seconds/Panel.
USHIO INC., (TOKYO:6925) (President and CEO: Shiro Sugata) announced that the company has succeeded in developing the ultra-fine, high-speed direct imaging (DI) system “UDI-8001P” with a resolution of 5 µm L/S and throughput of 35 seconds/panel. The “UDI-8001P”, which can be used for manufacturing next-generation FC-BGA packages for computers and network equipment, will be presented at booth 3I-03 of JPCA Show 2013, to be held at Tokyo Big Sight on June 5 (Wed.) through 7 (Fri.), as well as at the NPI Presentation Program on June 7.
The LDI systems currently used for manufacturing high-end packages such as FC-CSPs have a resolution of 10 to 15 µm L/S, an overlay accuracy of ±10 µm, and approx. 10 alignment points. The UDI-8001P achieves a much higher throughput — 35 seconds/panel — than conventional DI systems while offering a resolution of ±5 µm L/S, an overlay accuracy of ±5 µm, and 600 alignment points. The UDI-8001P thus allows processing of ultra-fine-pitch FC-BGA packages that could not be processed by the conventional DI systems.
At JPCA Show 2013, USHIO also will simultaneously announce another DI model “UDI-8102P” with resolution of 8 µm L/S for FC-CSP packages.
About USHIO INC.
Established in 1964, USHIO INC. (TOKYO: 6925) is a leading manufacturer of light sources such as lamps, lasers, and LEDs, in a broad range from ultraviolet to visible to infrared rays, as well as optical equipment and cinema-related products that incorporate these light sources. It also makes products in the electronics field, such as semiconductors, flat panel displays and electronic components, and in the visual imaging field, including digital projectors and lighting. Many of these products enjoy dominant market shares. In recent years, USHIO has undertaken business in the life science area, such as the medical and the environmental fields. See http://www.ushio.co.jp/en/.