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Dec 4th, 2012
USHIO announces at Semicon Japan 2012 that it will start shipping new large-field interposer stepper model UX7-3Di LIS 350 in March 2013
Achieving significant reduction of interposer manufacturing cost with large substrate and high throughput.
USHIO INC., (Headquarters: Tokyo, Japan; President and Chief Executive Officer: Shiro Sugata, http://www.ushio.co.jp), today announced that the company will start shipping the large interposer stepper “UX7-3Di LIS 350” dedicated to the manufacturing of large-field interposers for 2.5D advanced packaging applications in March 2013.
Based on the large-field stepper system “UX7-3Di LFS 300” for 2.5D/3D packaging released this fall, the UX7-3Di LIS 350 is able to process 405 mm x 350 mm interposer substrates as well as 300-mm silicon wafers. Also, it allows processing of interposers made of materials other than silicon, including glass, which has currently become popular, and organic materials. Furthermore, by mounting a large-diameter projection lens that allows projection of a large field of 78 mm x 66 mm, the UX-3Di LIS 350 can achieve incomparable throughput of 120 wafers per hour (for 300-mm wafers at 100 mJ/cm2).
As the result, the UX-3Di LIS 350 offers significant flexibility in designing interposers for 2.5D packaging applications, while allowing the manufacturing of large interposers as well as a significant reduction of manufacturing cost.
This product will be exhibited through a panel display and introduced by stage presentation at USHIO booth No. 4C-704 (Hall 4) of SEMICON Japan 2012, to be held on December 5 through 7 at Makuhari Messe in Chiba, Japan. Also, during SEMICON Japan 2012 USHIO plans to hold a release presentation and an exhibitor seminar at 11:00–11:20 on December 6 and at 12:30–13:20 on December 6 and 13:30–14:20 on December 7.
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