webleads-tracker

Home  >  ADVANCED PACKAGING  > Underfill challenges for 3D interconnect...
  >  ADVANCED PACKAGING
Oct 18th, 2012
 
Underfill challenges for 3D interconnect
 
Save the date for SEMATECH Workshop on Nov. 9, 2012 !
Send to a friend

3D Interconnect Technology is now entering a main stream. Underfill technology under 3D Interconnect manufacturability is critical to ensure process yield, reliability and adequate thermal management. The goal of this workshop is to share the immediate and coming challenges of underfill technology for 3D Interconnect.

The following topics will be covered by invited speakers:
- State of the Industry
- Scalability of Underfill and Process Challenges
- Thermal Concerns on 3D Interconnect
- Handling and Metrology
- Opportunities on New Materials
- April 2012 Survey Results on Underfill Challenges

This workshop, held on Nov.9 in San Jose, CA, is being held in conjunction with and in support of IWLPC.

To register, please click here.


 
More ADVANCED PACKAGING news

Sep 17th
Sep 11th
Sep 11th
Sep 11th
Sep 11th
 
©2007 Yole Developpement All rights reserved                  Disclaimer | Legal notice | To advertise
Yole Développement: Le Quartz, 75 cours Emile Zola, 69100 Villeurbanne, France. TEL: (33) 472 83 01 80 FAX: (33) 472 83 01 83 E-Mail: info @yole.fr