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Apr 1st, 2014
University of Washington selects altatech’s CVD system to develop new process materials
Altatech, a subsidiary of Soitec, has received an order from the University of Washington in seattle for an AltaCVD™ chemical vapor deposition (CVD) system whose unique combination of capabilities allows users to develop new process materials with high added value.
Altatech, a subsidiary of Soitec, will support its AltaCVD installation at the University of Washington from its U.S.-based business and service operation center.
The Altatech’s CVD system will be installed at the university’s Washington Nanofabrication Facility (WNF), where it will be used by both internal and external researchers in fabricating a broad range of semiconductor-based devices including leading-edge CMOS transistors, MEMS, ICs built with the latest in through-silicon-via (TSV) technology, advanced LEDs and solar cells.
“Extending the use of our CVD systems into this acclaimed user facility in North America continues to demonstrate the widely recognized advantages of our pulsed deposition technology,” said Jean-Luc Delcarri, general manager of Soitec’s Altatech subsidiary. “We are very pleased to add the University of Washington to the growing list of our CVD equipment adopters.”
The AltaCVD system uses pulsed deposition technology to offer a unique combination of capabilities for developing new materials. It can perform ALD for exceptional 3D coverage at deposition rates matching those of more conventional CVD techniques. This allows superior stoichiometry control while creating highly conformal thin and thick films, which cannot be achieved using many of existing technologies.
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