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Feb 24th, 2012
WLCSP from Yole Développement
In the 3D Packaging, Feb. 2012 issue, Yole Développement talks about WLCSP.
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Market dynamics impact WLCSP adoption
For connectivity devices, WLCSP became the standard package in 2010, and the market is poised to continue growing.

Wafer-level chip-scale package (WLCSP) market growth is expected to climb by 12.6% during the next 5 years, while the compound annual growth rate (CAGR) for 2010–2016 appears to be growing much faster for MEMS and image sensors (at 25%) than for CMOS and analog ICs (at 7%)—in WLCSP units.


WLCSP market trends to watch in 2012
2012 should be a robust year for the WLCSP market, with interesting supply chain trends emerging.

There are essentially two wafer-level chip-scale package (WLCSP) supply chains: One for fan-in WLCSPs, which are considered “regular” WLCSPs without through silicon vias (TSVs), and a separate one for 3D WLCSPs, which are WLCSP packages with multiple levels of dies or lids and TSVs. 3D WLCSP applies to MEMS and to many CMOS image sensors.

To read the complete articles, please click here.

Source: 3D Packaging Feb. 2012 - Powered by Yole Développement



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