Wafer-level chip-scale packages (WLCSPs) comprise only about 6% of all ICs, yet quietly became the IC industry’s most popular type of package in 2009. This just goes to show how many packaging options are out there, Yannou says, but also proves that WLCSP has finally established itself within the industry. WLCSPs are now the fastest-growing package on the market, on target to claim 8.3% of the entire market by 2013.

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