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Aug 6th, 2013
WaferBond ‘13 - Call for paper
The International Conference on Wafer Bonding – WaferBond ‘13 will be held at the KTH Royal Institute of Technology December 5th to 6th, 2013, in Stockholm, Sweden.
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You are invited to present your latest results in wafer bonding technologies and their application in microsystems of any kind, to demonstrate the use of wafer bonding in complex devices, to share information regarding wafer bonding equipment, bond testing methodology, and finally to meet your peers in this field for fruitful discussion.

The conference will cover all aspects of bonding wafers and comparable substrates from basic research to industrial applications, so any contribution about this is welcome. Beside this general approach this year the focus will be on the following topics:
- Metal based Wafer Bonding Technologies
- Temporary Wafer Bonding for Wafer Thinning and Thin Wafer Handling
- Wafer Bonding in Northern Europe
- Wafer Bonding in Industrial Processes: Processes Stability and Reliability
- Enabling new Technologies and Devices for modern Applications by Wafer Bonding
- The future of Wafer Bonding

Especially for these exciting topics there will be invited key notes complemented by the contributions we hope to get from the wafer bonding community and from you.

Abstracts (max 200 words) should be submitted by August 26th, 2013 (extended deadline), to roy.knechtel@xfab.com. The use of the abstract template is required. Authors will be informed of acceptance by September 20th, 2013. Extended abstracts (2 pages) are due October 30th, 2013. Authors will have again the opportunity to publish a full paper in the Springer Journal Microsystem Technologies.

Local Chair
Frank Niklaus
KTH Stockholm

Technical Chair
Roy Knechtel
X-FAB Semiconductor Foundries

Contact: roy.knechtel@xfab.com / Phone: +49 361 427 6584 / www.microtesting.de


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