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Mar 6th, 2012
Which companies will be the drivers of TSV packaging technology?
Here is a great article about 2.5D and 3DIC technologies posted by Javier DeLaCruz, Manufacturing Director at eSilicon.
There are two general flavors of 3D-TSV technology. Images for these can be seen in the previous blog entry “The Future of ASICs in 3D.”
There are also several combinations like rocky road that combine elements of each and introduce other ingredients. Much like consumers of ice cream that gravitate to certain flavors, so are the types of companies that will utilize each of these technology flavors, and for very good reasons.
There is also be a cost premium to this solution, as it would be less expensive to design these active die as a monolithic ASIC, or different MCM (multi-chip module) solution. The users for this will be those willing to pay a premium for this smaller, lower-power option. Hence, the main users for this will be mobile devices. A smaller phone with a longer battery life is worth more to the end consumer so the mobile component manufactures can justify this premium. The lower power usage in this space is also a great fit for this technology.
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