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Apr 30th, 2012
Wolverine announce agreement with Infineon for manufacturing of its Microcool technology
Wolverine’s MicroCool® Division is proud to announce its global License Agreement with Infineon Technologies AG for the development, manufacture, and sale of its current MDT technology.
“MicroCool®-Clad™, provides Infineon and other IGBT module manufactures around the world with the opportunity to fully leverage the improved bonding strength and heat spreading capability of copper with the lightweight, lower cost and additional reliability afforded by an aluminum pin structure in the fluid chamber,” said Peter Beucher, Director of MicroCool®. “Wolverine’s MicroCool® pin fin surface geometry is uniquely suited to deform 2.0mm of clad aluminum into a 6.0mm pin fin structure. We are able to approach copper cold plate thermal performance at lower cost and no nickel plating associated with all copper base plates.” Wolverine Tube’s MicroCool® Division will display for the first time at the PCIM conference in Nuremberg, May 8-10th, several clad metal, integrated base plates. Wolverine will be prepared to discuss specific ustomer opportunities and build sample prototype base plates with a wide variety of straight line fins and pin fin structures to meet specific customer requirements. In conjunction with Infineon, Wolverine will be able to share thermal data and test results from cycle testing.
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