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> MEMS
Feb 22nd, 2012
Yole Développement presents it MEMS, Power Electronics, Advanced Packaging and LED analysis at two main Chinese events
SEMICON China & electronica China 2012 - March 20 to 22, 2012.
SEMICON China 2012 connects you to the innovations, ideas, and information driving the business and technology of microelectronics manufacturing, as well as exciting new and expanding opportunities in Semiconductor Manufacturing. Please come to visit Yole Développement analysts on the booth # E4-4756 or during the following conferences: - LED cost and performance: how to enable massive adoption in general lighting ... 3D integration using through silicon via (TSV) has first been used for MEMS and CMOS image sensor integration: now 3D is moving to the mainstream IC business, with the emergence of wide input/output interface, stacked DRAM using TSV and chip partitioning. The presentation will highlight the market trends, strategy of the main players and evolution of the supply chain in order to fulfill the requirements of the production, test and packaging of such devices... - New dynamics of the MEMS inertial sensor market With more than 600 exhibitors and 35,000 square meters, the 11th electronica China and Productronica China will be presented in two parallel shows under uniquebrand names, to cover the whole spectrum of the electronics industry. - Inverters technologies, market and supply chain trends Sources :
More MEMS news May 22nd
May 22nd
May 16th
May 15th
May 15th
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