Dec 13th, 2013
Yole Développement to address on 3D packaging market trends and applications at the European 3D TSV Summit 2014
The French consulting company, Yole Développement will participate actively in the European 3D TSV Summit 2014, organized by SEMI Europe, from January 20 to 22, 2014, in Grenoble (France)
Building on the success of the 1st edition that attracted almost 320 people from 20 countries, the theme of next year’s event is “Application Ready,” addressing 3D TSV from both a business and technology perspective. The latest TSV product developments and achievements — including cost, business models, supply chain, manufacturability and technology aspects — will be addressed by executives and experts from global leading companies.
This year again, Yole Développement and its Advanced Packaging team, decided to be part of the event:
- On January 20, Jean-Christophe Eloy, President and CEO of Yole Développement, will moderate the Panel Session of the Pre-Summit Symposium: “TSV for MEMS”. The panelists coming from Silex Microsystems, STMicroelectronics, Tronics Microsystems, X-FAB will debate on the following topic: MEMS, killer application for 3D TSV Integration?
- On January 21, Rozalia Beica, CTO and Business Unit Director, Advanced Packaging & Manufacturing, at Yole Développement, will held a presentation in the first session, “Market Outlook”. With a strong focus on 3D packaging market trends and applications, come and learn about supply chain interaction and key players, technology roadmaps for 3D integration, etc. “Semiconductor industry, for more than four decades, has rigorously followed Moore’s Law in scaling down the CMOS technologies. Although several new materials and processes are being developed to address the challenges of future technology nodes, in the coming years they will be limited with respect to functionalities that future devices will require. As a consequence a clear trend of moving from CMOS to package and system architecture can be observed,” says Rozalia Beica.
Three heavyweight semiconductor companies will deliver the keynote talks at the European 3D TSV Summit. Executives from STMicroelectronics, TSMC and STATS ChipPAC will share their company perspectives. European 3D TSV Summit features: more than 25 presentations, panel discussions, one-on-one business meeting service, market-specific sessions, pre-summit TSV symposium for MEMS, exhibition show floor, CEA-LETI 300mm TSV line tour, CATRENE 3D Session and networking dinner and cocktails.
Feel free to come and listen to Yole Développement’s experts and others (Agenda) and register now!
About 3D TSV European Summit – www.semi.org
SEMI Europe Grenoble Office is a non-profit organization supporting micro and nano-electronics companies based in France and Southern Europe. Ideally located at the heart of the French Silicon Valley and at the crossroad of Southern Europe, SEMI Europe Grenoble Office is one among the SEMI offices spread over the world. Working in close collaboration with the other European offices of Berlin, Brussels, Moscow and with the headquarters in USA, SEMI Europe Grenoble Office provides various services to its members to support their interests and contribute to their sustainable growth.
More ADVANCED PACKAGING news